UDIMM vs DIMM
Wouldn’t it be wrong to say that in this fast-paced and tech-impregnated world, people are unaware of computer memory configurations? Well, it sure is bad, and if you want to gain information about DIMM, it is the dual in-line memory module. This computer memory is installed into the memory slots of the motherboard. These are usually named RAM sticks and UDIMM as well.
DIMM is comprised of dynamic RAMM integrated circuits, topped on the circuit board. DIMM is regularly used for personal and workplace computers, in addition to servers. With the launch of the Pentium processor by Intel, the SIMMs were replaced by DIMMs. Often times, SIMM is named the predecessor of DIMM, standing for a single in-line memory module.
SIMMs had redundant contacts on both sides, but DIMM is designed with a separate electrical contact on both sides of the modules. DIMMs are designed with a 64-bit data plan in contrast to a 32-bit data path. When the Pentium processor was launched by Intel, the need for matched pair integration of 64-bit bus width arose, but SIMMs weren’t coping with this.
Consequently, DIMMs had to be designed to put with this demand, so the SIMMs wouldn’t be needed to integrate into parallel sets. In addition, the 64-bit data path ensured faster data processing and transferred as compared to SIMM. Over the years, it has become a native and standard form of computer memory. DIMM is installed on the motherboard, storing information in different memory cells.
UDIMM & DIMM
For the longest time possible, the tech geeks have been pondering how UDIMM and DIMM are related. So, DIMM is basically the dual in-line memory module which is the unregistered memory configuration. In addition, DIMM is usually referred to as conventional memory. Now, there are four basic types of DIMM out there, inclusive of;
- UDIMM – unregistered and unbuffered memory
- RDIMM – registered memory
- SO-DIMM – the basic laptop RAM
- FBDIMM – fully buffered memory
With this being said, UDIMM is the normal RAM and unbuffered DIMM. This is the memory chip, extensively used in laptops and desktop computers. These UDIMMs portray a faster performance rate. This memory configuration is reasonably-priced but there might be a compromise on stability. For better insights, we have designed this article, sharing information about DIMM, its architecture, and how different factors can impact the latency of your computer memory. Shall we begin?
Architecture of DIMM
As we have already mentioned, DIMM is the printed circuit board, integrated with SDRAM and/or DRAM integrated circuits. However, there are other components that optimize the performance and outline the functionality of DIMM, such as;
The density of the chip was basically incremented to enhance the performance standards, promising better generation of clock speed but more heat as well. Previously, 16GB and 8GB chips were used, but they weren’t optimizing the heat development. However, when the chip density was enhanced to 64GB, the reduction of heat had been crucial.
On the other hand, the heat reduction technologies were developed by tech manufacturers for minimizing the heat generation from DIMS. There were cooling fins, implied for the excess heat venting. The heat is vented out from motherboard into the exit-way of computers.
The latest DIMMs are designed with independent DRAM chipsets, also known as memory ranks. These ranks lead to DRAM page initiation, leading to a better performance rate. It is pretty clear that ranks are connected to a similar address while creating a dense memory for the processors. In contrast, the processors don’t access the ranks for identical operations.
The processors are empowered with interleaving that helps utilize the ranks through different operations. The users can write to one rank, but reading will be from other outlets. Upon completion of operations, DRAM is used for flushing the data. In this queue, the single channels can lead to stalling in the pipelines.
When it comes down to DIMM, the single-channel memory is the minimal prerequisite for communication with the processor. Consequently, the 64-bit channels are designed through dual-channel memory, xx” for the quad-channel, and xx for triple-channel. But it’s essential to outline that DIMM technology doesn’t signal the multi-channel memory.
The signal data rate of DIMM was designed back in the 1960s. In this quest, speed and performance rate is measured in nanosecond form. The DRAM speeds are enhanced through SDRAM, posing synchronization changes to the clock timing in CPU. This technology tends to activate quickly while determining the accurate time for data processing. With this being said, there are zero delays for CPU processing.
When it comes down to DIMM and DDR, there are four different generations, such as DDR, DDR3, DDR2, and DDR4. The DDR2 is designed to fasten up the transfer rate while buffering out the first generation. On the other hand, DDR3 helps enhance performance while posing a reduction in power consumption. Last but not least, DDR4 not only reduces the voltage but enhances the performance and transfer rate.
Moving on to the DIMMs, there are single ranks, designed with high capacity. On the other hand, processors will parallelize the rank modules and memory requests. In the section below, we have added multiple factors that can impact the memory latency with DIMM within a computer system. Have a look!
With fast DIMM speed, the latency rate will be lower, leading to loaded latency. The latency rate is increased when the memory requests are sent constantly, staying strong for execution. The faster DMM speed leads to quick memory control. With such speeds, the queued commands are processed quickly.
With DIMM and DDR4 memory speed, the loaded latency is increased with increment in ranks. The higher rank speed will optimize higher capability for processing the memory requests. In addition, it helps reduce the request queues size while enhancing the capability to control the refresh commands. However, it tends to reduce the loaded latency by multiple ranks. When the channel ranks are increased from four, the loaded latency increases.
CAS is designed as the column address strobe that tends to represent the DRAM response time. The number of clock cycles is specified, such as 13, 15, and 17. The column address is designed on the bus but has unloaded and loaded latency measurements.
The memory bus utilization, when increased, is less likely to change the read the low level of latency. This is reduced on the memory bus. The users need to manually write and read down the commands.
However, the same amount of time is required to complete these commands, irrespective of the traffic. When the utilization is increased, the memory system latency is increased because queues are jam-packed with the latency, incorporated into the memory controller.